Press Release: aveni : aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 TSVs
Collaboration with CEA-Leti, within the framework of IRT Nanoelec, successfully integrates Electrografted Rhea copper seed layer into process flow
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aveni develops a metallization platform that offers electrografting and chemicalgrafting solutions for semiconductor, MEMS and packaging sectors.
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