Broadcom Inc. announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure. These innovative technologies, including advancements in co-packaged optics (CPO), 200G/lane DSP and SerDes, 400G optics, and PCIe Gen6 over optics, have been announced at the 2025 Optical Fiber Communications Conference and Exhibition (OFC). The company's demonstrations highlight the firm's [...] The post OFC 2025: Broadcom Advances Optical Connectivity for AI Infrastructure appeared first on StorageNewsletter.
Broadcom is a California-based technology company that designs, develops and supplies semiconductor equipment, software products and security solutions for various industries.