EVG: EVG highlights heterogeneous integration technologies at ECTC

EV Group of St Florian, Austria - a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS) and nanotechnology applications - says that new developments in heterogeneous integration enabled by its wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding, lithography and infrared (IR) laser release solutions are being highlighted in papers presented at the 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) at The Gaylord Rockies Resort & Convention Center in Denver, CO, USA (28-31 May), where EVG is also exhibiting in booth 522...