Press Release: ITW Dynatec : ITW Dynatec to Preview New "Simplicity" Hot Melt Adhesive Supply Unit at Pack Expo 2016

ITW Dynatec, a global leader in bonding and sealing applications, will feature smart hot melt solutions designed for 'today and tomorrow' at Pack Expo 2016, McCormick Place, Chicago, IL, November 6-9, Booth N-5725. Hendersonville, TN (PRWEB) October 14, 2016 The company will showcase the latest model of its popular and proven Dynamelt S Series adhesive [...]The post ITW Dynatec to Preview New "Simplicity" Hot Melt Adhesive Supply Unit at Pack Expo 2016 appeared first on Press Release Rocket.