Laird: Silicone-free gap filler features high thermal conductivity

Laird Performance Materials continues to focus on innovation with its release of its Tflex SF10 Series, a silicone-free gap filler delivering 10 W/mk thermal conductivity along with low deflection properties enabling it to exert minimal pressure on delicate components. Along with no silicone and its high thermal conductivity, a key differentiator of Laird's Tflex SF10 [...] The post Silicone-free gap filler features high thermal conductivity appeared first on Electrical Engineering News and Products.