MediaTek: MediaTek Introduces Dimensity 9400+ Flagship Chipset

MediaTek has officially announced the Dimensity 9400+, an upgraded version of its Dimensity 9400 chipset, designed to deliver enhanced performance for flagship smartphones. The new processor incorporates advanced artificial intelligence (AI) capabilities, improved efficiency, and cutting-edge gaming features, making it a notable addition to MediaTek's portfolio of mobile chipsets. Table of Contents Toggle Enhanced Performance with All Big Core Design Advanced AI Capabilities Gaming Enhancements: PC-Level Features on Smartphones Imaging and Connectivity Improvements Energy Efficiency and Battery Life Availability and Upcoming Devices Conclusion Enhanced Performance with All Big Core Design width) 1024px, (max-width: 1024px) 100vw, 1024px"> The Dimensity 9400+ is built on TSMC's second-generation 3nm process, offering up to 40% better power efficiency compared to its predecessor, the Dimensity 9400. It features an All Big Core CPU architecture, combining one Arm Cortex-X925 core clocked at up to 3.73 GHz with three Cortex-X4 cores and four Cortex-A720 cores. This configuration ensures superior single-threaded and multi-threaded performance, catering to demanding Android user experiences. To further boost computational power, the chipset includes a substantial cache system with 12MB of L3 cache and 10MB of system-level cache (SLC). This design allows for faster data access and processing, making it ideal for resource-intensive applications such as gaming and AI-driven tasks. Feature Category Specifications CPU & Performance 1x Cortex-X925 up to 3.73GHzAll big core CPU: Cortex-X925, Cortex-X4, Cortex-A72012MB L3 Cache, 10MB SLC GPU & Gaming 12-core G925 GPU with opacity micromaps (OMM)MediaTek Frame Rate Converter (MFRC) 2.0+ (up to 40% power saving)MediaTek Adaptive Gaming Technology (MAGT) 3.0 AI Capabilities MediaTek NPU 89020% faster AI performance with Speculative Decoding+ (SpD+)Deepseek-Ri-Distill (1.5B/7B/8B) model support on-device processingComprehensive SLM+LLM AI model supportEnhanced multi-modal AI efficiency, content understanding, cross-app inference, and GUI-based control Connectivity Bluetooth: Extend direct phone-to-phone BT up to 10km (line of sight)GNSS: New BeiDou satellite support (33% faster TTFF without cellular)5G: 3GPP Release-17, 4CC-CA up to 7Gbps DL, MediaTek UltraSave 4.0, AI Network Suite 2.0, 5G/4G Dual SIM Dual Active, Dual DataWi-Fi: Up to 7.3Gbps DL, Wi-Fi 7 with 5-stream 3-band concurrent connections, MediaTek Xtra Range 3.0 Camera & Audio Features Lightning Snapshot Camera (AI enhanced)Gen-AI Telephoto with crystal-clear extreme zoomAI Audio Focus up to 6 mic / 24bit audioFull-range HDR zoom with smooth zoom switching and standard target autofocusSuper high-res BT audio playback up to 24bit / 384KHz Advanced AI Capabilities The Dimensity 9400+ introduces the MediaTek NPU 890 neural processing unit, which supports on-device generative AI models like DeepSeek R1. This model leverages technologies such as Mixture-of-Experts (MoE), Multi-Head Latent Attention (MLA), Multi-Token Prediction (MTP), and FP8 inferencing for faster reasoning speeds. These advancements result in a 20% improvement in generative AI performance compared to the previous generation. Additionally, the chipset integrates the Dimensity Agentic AI Engine (DAE), enabling developers to transform traditional AI applications into more sophisticated agentic AI solutions. This capability enhances multi-modal AI efficiency, cross-app inference, and content understanding, delivering smarter and more personalised user experiences. Gaming Enhancements: PC-Level Features on Smartphones Gaming enthusiasts will benefit from the Dimensity 9400+'s powerful GPU-the 12-core Arm Immortalis-G925-which supports opacity micromaps (OMM) for realistic visual effects. This feature enhances elements such as vegetation, hair, and feathers in games without compromising performance. Furthermore, MediaTek's Frame Rate Converter 2.0+ doubles effective frame rates while improving power efficiency by up to 50%. The chipset also introduces MediaTek Adaptive Gaming Technology (MAGT) 3.0 to sustain peak gameplay speeds over extended periods without lag or overheating. These features collectively bring PC-level gaming experiences to mobile platforms. Imaging and Connectivity Improvements MediaTek's Imagiq 1090 image signal processor enables HDR video recording across the entire zoom range with seamless transitions between focal lengths. The Smooth Zoom technology ensures high-quality capture of moving subjects while isolating audio and visuals effectively. Connectivity enhancements include expanded Bluetooth range with direct phone-to-phone connections reaching up to 8 kilometres-four times further than its predecessor. The chipset also supports BeiDou satellite connections for faster location fixes without cellular networks. Additionally, Wi-Fi 7 tri-band concurrency with five streams provides up to 30 metres greater coverage compared to earlier models. Energy Efficiency and Battery Life MediaTek UltraSave 4.0 technology contributes to an impressive reduction in energy consumption during mobile data usage, achieving up to 18% savings in power for 5G traffic management. Combined with its efficient design on the 3nm node, the Dimensity 9400+ promises extended battery life for smartphones equipped with this chipset. Availability and Upcoming Devices The first smartphones powered by the Dimensity 9400+ are expected to launch in Q2 of 2025. Confirmed devices include the Realme GT 7, OPPO Find X8S series, and Vivo X200S. The Realme GT 7 is rumoured to feature a massive 7,000mAh battery with support for ultra-fast charging and advanced cooling solutions. Conclusion The MediaTek Dimensity 9400+ represents a significant upgrade over its predecessor by combining cutting-edge AI capabilities, enhanced gaming features, improved connectivity options, and exceptional energy efficiency. As flagship smartphones equipped with this chipset begin rolling out later this year, users can anticipate devices that deliver robust performance across various applications while maintaining extended battery life and reliable connectivity.