Press Release: SPIL : Siemens Collaborates with SPIL to Deliver A 3D Verification Workflow for Fan-out Wafer-level Packaging
NewswireToday (newswire) - Siemens has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd (SPIL) - SPIL.com.tw / Siemens.com
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President & CEO
Chi-Wen Tsai
SPIL is focused on semiconductor packaging and testing services for PC, communications, consumer integrated circuits markets.
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