SPIL: TSMC's go-to partner for AI demand: ASE's SPIL invests US$1.3 billion to boost CoWoS capacity
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has taken over the CoW process alongside Amkor Technology, helping TSMC meet the rising demand for AI and HPC chip packaging.
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President & CEO
Chi-Wen Tsai
SPIL is focused on semiconductor packaging and testing services for PC, communications, consumer integrated circuits markets.
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