STATS ChipPAC: STATS ChipPAC achieves 1.5B unit milestone in fan-out wafer level packaging shipments
STATS ChipPAC Pte. Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB).
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President & CEO
Han Byung Joon
STATS ChipPAC provides semiconductor packaging and test services to communication, consumer and computing markets.
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