STATS ChipPAC: STATS ChipPAC Expands AEC-Q100 Qualification of eWLB for Automotive Applications

(4-traders.com) UNITED STATES, May 01, 2018 (GLOBE NEWSWIRE) -- SINGAPORE, May 02, 2018 -- STATS ChipPAC Pte. Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, announced today the expanded qualification of its embedded Wafer Level Ball Grid Array (eWLB) technology for...http://www.4-traders.com/news/STATS-ChipPAC-Expands-AEC-Q100-Qualification-of-eWLB-for-Automotive-Applications--26467497/?utm_medium=RSS&utm_content=20180502