ARIZ.-Triton Micro Technologies' ultra-thin through-glass-via (TGV) interposers create 3,000 or more I/O connections per device for high-density IC packaging. Triton uses micro-drilling and via-fill technologies to manufacture 2.5D and 3D TGV interposers for MEMs, RF and optics applications on wafers up to 300mm with thicknesses of 0.7mm and below.
